AS I AM Bond Mask Moisturizing (227gr)

Repairing Hair Mask

Benefits:
Protects hair from future damage, reduces porosity, and deeply moisturizes both hair and scalp.

Bond Complex Technology:
This innovative technology reconnects broken disulfide bonds, restoring elasticity and strengthening the hair structure for lasting health and strength.
Submicron Technology: This advanced submicron technology breaks down ingredients into ultrafine particles, allowing them to penetrate the hair and scalp more effectively.
This ensures deeper hydration, a stronger skin barrier, and better protection against damage or irritation.

How to use:
After cleansing and conditioning, apply generously to hair.
Leave on for at least 5 minutes for maximum nourishment.
Rinse thoroughly.
Follow in As I Am Bond Leave-In Conditioner for optimal results.

Ingredients:
Aqua/Water/Eau, Betaine, Cetearyl Alcohol, Cetyl Alcohol, Hydrogenated Polydecene, Ricinus Communis (Castor) Seed Oil, Brassicamidopropyl Dimethylamine, Polyquaternium-37, Moringa Oleifera Leaf Extract, Phyllanthus Emblica Fruit Extract, Ceramide NP, Ceramide EOP, Ceramide AP, Copper Tripeptide-1, Serenoa Serrulata Fruit Extract, Hydroxypropyl Bisstearamide MEA, Hydroxypropyl Bislauramide MEA, Phytosterols, Phytosphingosine, Biotin, Hydroxypropylgluconamide, Hydroxypropylammonium Gluconate, Potassium Olivate, Polyglyceryl-10 Stearate, Stearic Acid, Fragrance/Parfum, Isostearyl Ethylimidazolinium Ethosulfate, Propylene Glycol Dicaprylate/Dicaprate, Polyquaternium-7, PPG-1 Trideceth-6, Lactic Acid, Polyacrylamide, Caprylyl Glycol, Sodium Benzoate, Potassium Sorbate, Ethylhexylglycerin, Maltodextrin, Limonene.

Size: 227g