AS I AM Bond Conditioner (237ml)

Conditioner that repairs damaged hair and reduces breakage.

Benefits:
Repairs and strengthens hair bonds, improves elasticity, reduces breakage, and balances hair porosity.
Helps retain moisture, strengthens hair, and promotes elasticity.

Bond Complex Technology:
This innovative technology reconnects broken disulfide bonds, restoring elasticity and strengthening the hair structure for lasting health and strength.
Submicron Technology: This advanced submicron technology breaks down ingredients into ultrafine particles, allowing them to penetrate the hair and scalp more effectively. This ensures deeper hydration, a stronger skin barrier, and better protection against damage or irritation.

How to use:
After cleansing, apply generously to the lengths of your hair. Rake through with your fingers or a wide-tooth comb to ensure even distribution and facilitate detangling.
Leave on for at least 3 minutes for maximum hydration. Rinse thoroughly and then apply As I Am Bond Leave-In Conditioner for best results.

Ingredients:
Aqua/Water/Eau, Betaine, Cetearyl Alcohol, Cetyl Alcohol, Brassicamidopropyl Dimethylamine, Hydrogenated Polydecene, Moringa Oleifera Leaf Extract, Phyllanthus Emblica Fruit Extract, Ceramide NP, Ceramide EOP, Ceramide AP, Copper Tripeptide-1, Phytosphingosine, Serenoa Serrulata Fruit Extract, Phytosterols, Hydroxypropyl Bislauramide MEA, Hydroxypropyl Bisstearamide MEA, Hydroxypropylgluconamide, Hydroxypropylammonium Gluconate, Biotin, Potassium Olivate, Polyglyceryl-10 Stearate, Stearic Acid, Fragrance/Parfum, Propylene Glycol Dicaprylate/Dicaprate Polyquaternium-37, PPG-1 Trideceth-6, Polyquaternium-7, Lactic Acid, Caprylyl Glycol, Ethylhexylglycerin, Sodium Benzoate, Potassium Sorbate, Polyacrylamide, Maltodextrin, Limonene.

Size: 237ml